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50 ;my applications ??y features goy ordering code m multilayer ceramic capacitors m
u
??? x7r k 55 vj 125 c q b m 15 l bj x5r k 55 vj 85 c m 15 l q f y5v k 30 vj 85 c l k m 10 m m 20 z a4 j6.3 l10 e16 t25 u50 k y?? ? q b,bj m 10 l q f l `
u
?? ??? ?? ? ?p%~ class 2 standard multilayer ceramic capacitors (class2 :high dielectric constant type) y 1 ?y h vdc i 3 z??? 5 9s?
q 7 0??0) hli k a j x?7 9 b o ? f >g? g f a?e?? f 2mm e?? y 178 bg t a?e?? f 4mm e?? y 178 bg a
6 ? ?
i?0? h pf i 4 y
go f eia g l p w h mm i 063(0201) 0.6 p 0.3 105(0402) 1.0 p 0.5 107(0603) 1.6 p 0.8 2 3??? 10 ptgg? 11 a4 j6.3 l10 e16 t25 u50 k plated 1 rated voltage h vdc i 3 end termination y 5 temperature characteristics code 7 capacitance tolerance hli k standard products y 9 b bulk f tape&reel f 2mm pitch y 178 bg t tape&reel f 4mm pitch y 178 bg packaging y 6 nominal capacitance h pf i 4 dimensions (case size) f l p w gh mm i 2 y 10 11 y `??;+; y ?;+;3?z phs z??? etc. y ?
sw2 u
$??b y t?3??w?wh?z ?t
qu?m y ? yz
i?0? c?u?m ? 102 1000 223 22000 q a j y general electronic equipment y communication equipment (portable telephones, phs, other wireless ap- plications, etc.) y improve higher mounting densities. y multilayer block structure provides higher reliability y a wide range of capacitance values available in standard case sizes. j 30 k 80 example 102 1000 223 22000 internal code q standard products 063(0201) 0.6 p 0.3 105(0402) 1.0 p 0.5 107(0603) 1.6 p 0.8 k m 10 m m 20 z y qw blank space 8
a ?? h mm i p0.3 v0.5 z0.8 8 thickness h mm i p0.3 v0.5 z0.8 qw ?? series name special code qw ?? y b k 25 vj 85 c x7r k 55 vj 125 c x5r k 55 vj 85 c f k 25 vj 85 c y5v k 30 vj 85 c b/bj f operating temp. qw blank space _ f z 11 10 8 9 7 6 5 4 1 2 3 lmk105bj104kv code temp.characteristics operating temp. range j 80 k 20 j 80 k 20 j 22 k 82
51 capacitors ?
goy external dimensions 4 p.52 p.76 p.78 p.89 p.8 ?t??3??y available capacitance range type f eia g lw t e g mk063 0.6 m 0.03 0.3 m 0.03 0.3 m 0.03 p 0.15 m 0.05 f 0201 gf 0.024 m 0.001 g f 0.012 m 0.001 gf 0.012 m 0.001 g f 0.006 m 0.002 g g mk105 1.0 m 0.05 0.5 m 0.05 0.5 m 0.05 v 0.25 m 0.10 f 0402 gf 0.039 m 0.002 g f 0.020 m 0.002 g f 0.020 m 0.002 gf 0.010 m 0.002 g g mk107 1.6 m 0.10 y 0.8 m 0.10 5 0.8 m 0.10 z 0.35 m 0.25 f 0603 gf 0.063 m 0.004 g f 0.031 m 0.004 g f 0.031 m 0.004 gf 0.014 m 0.010 g unit d mm f inch g ??aa part numbers ?
q
$ electrical characteristics a packaging ?t
q reliability data ?; w?? precautions ?3???? selection guide etc bb z;
u
??????? general multilayer ceramic capacitors ? d ???wg?x
a ??g?pb{ note d letter codes in shaded areas are thickness codes. i 1 i 1 i 1 i 1 [ pf ] 100 150 220 330 470 680 1000 1500 2200 3300 4700 6800 10000 15000 22000 33000 47000 68000 100000 220000 470000 1000000 [ pf 3digits ] 101 151 221 331 471 681 102 152 222 332 472 682 103 153 223 333 473 683 104 224 474 105 type temp.char. wv cap 063 105 107 b/x5r f/y5v b/x7r f/y5v b/x7r f/y5v 16v 10v 6.3v 6.3v 4v 50v 25v 16v 10v 6.3v 50v 25v 16v 10v 6.3v 50v 25v 50v 25v v v v v vv i 1 i 1 i 1 v p p p p p p p p v v v z z z z z z v v i 1 items are only available in x5r 9s?
qy temperature characteristics
i?0? !=p capacitance change [%] j 22 k 82 , j9s ref. temp. [ c ] 9s?
q temperature
i?0??0)y capacitance tolerance y b k 25 v 85 20 m 10 y x7r k 55 v 125 25 m 15 y x5r k 55 v 85 25 m 15 y f k 25 v 85 20 y y5v k 30 v 85 25 j 30 k 80 ?0) tolerance item g? code tan d y 063 t 3.5 l b char. 16v t 5.0 l b char. 10v t 10 l b char. 0.022 v 0.1 a f t 16 l f char. 6.3v t 20 l f char. 4v t 2.5 l b char. 50v, 25v (0.0068 a f) t 3.5 l b char. 16v, 0.027 v 0.047 a f, 25v (0.01 a f) t 5.0 l f char. 50v, 25v b char. 0.056 v 0.22 a f t 7.0 l f char. 0.033 a f, 0.047 a f 105 t 9.0 l f char. 0.068 a f v 0.1 a f t 10 l b char. 0.47 a f v 1 a f t 11 l f char. 0.22 a f t 16 l f char. 0.47 a f t 20 l f char. 1 a f 107 t 2.5 l b char. t 5.0 l f char. type tan d item characteristics 9s c? operating temp. range [ c ] f 1 f 1 y *t
:y measurement frequency w 1 m 0.1khz yy ?yyy measurement voltage w 1 m 0.2vrms k m 10 l b char. m m 20 l b char. z j 80 l f char. k 20 p
52 ??aay part numbers 105type(0402 case size) 220 330 470 680 50v 1000 1500 2200 b/x7r 2.5 3.5 ? 10% 0.5 ? 0.05 3300 ? 20% (0.020 ? 0.002) 4700 r 25v 6800 10000 22000 16v 33000 15000 47000 10v 100000 b/x5r x5r 100000 470000 50v 10000 5 10 25v 22000 16v 47000 5 100000 f/y5v 7 80 ? 10v 220000 9 20 ? 6.3v 6.3v 470000 11 1000000 1000000 16 20 y ?yy rated voltage f dc g yy? thickness h mm i (inch)
i?0? ? 0 ) capacitance tolerance [ l ] ?yy ?
i?0? capacitance h pf i 9s?
q temp.char yy ordering code umk10 5 b j 2 2 1 g v umk10 5 b j 3 3 1 g v umk10 5 b j 4 7 1 g v umk10 5 b j 6 8 1 g v umk10 5 b j 1 0 2 g v umk10 5 b j 1 5 2 g v umk10 5 b j 2 2 2 g v umk10 5 b j 3 3 2 g v tmk1 0 5 b j 4 7 2 g v tmk1 0 5 b j 6 8 2 g v tmk1 0 5 b j 1 0 3 g v tdk105 bj153 g v tdk105 bj223 g v emk10 5 b j 3 3 3 g v emk10 5 b j 4 7 3 g v emk10 5 b j 1 0 4 g v* lmk1 0 5 b j 1 0 4 g v lmk1 0 5 b j 2 2 4 g v* jmk105 bj224 g v jmk105 bj474 g v* jmk105 bj105 g v* umk10 5 f 1 0 3 z v tmk1 0 5 f 2 2 3 z v emk10 5 f 4 7 3 z v emk10 5 f 1 0 4 z v lmk1 0 5 f 2 2 4 z v jmk105 f474zv jmk105 f105zv* 220000 220000 tan dissipation factor h % i max. ?
e soldering method r: ??? reflow soldering w: ?? wave soldering 063type(0201 case size) ? 10 ? 0.3 ? 0.03 ? 20 ? (0.012 ? 0.001) 80 ? ? 20 ? 0.3 ? 0.03 (0.012 ? 0.001) y ?yy rated voltage f dc g yy? thickness h mm i (inch)
i?0? ? 0 ) capacitance tolerance [ l ] ?yy ?
i?0? capacitance h pf i 9s?
q temp.char yy ordering code tan dissipation factor h % i max. ?
e soldering method r: ??? reflow soldering w: ?? wave soldering w g tx
i?0??0)g?u???b{ g please specify the capacitance tolerance code. 16v 10v 6.3v 4v emk06 3 bj 1 0 1 g p emk06 3 bj 1 5 1 g p emk06 3 bj 2 2 1 g p emk06 3 bj 3 3 1 g p emk06 3 bj 4 7 1 g p emk06 3 bj 6 8 1 g p emk06 3 bj 1 0 2 g p lmk0 6 3 bj 1 5 2 g p lmk0 6 3 bj 2 2 2 g p lmk0 6 3 bj 3 3 2 g p lmk0 6 3 bj 4 7 2 g p lmk0 6 3 bj 6 8 2 g p lmk0 6 3 bj 1 0 3 g p jmk063 bj223 g p jmk063 bj473 g p jmk063 bj104 g p* jmk063 f223zp jmk063 f473zp amk06 3 f 1 0 4 z p 100 150 220 3.5 b/x5r r 5 f/y5v x5r 10 16 20 330 470 680 1000 2200 1500 3300 4700 6800 10000 22000 47000 22000 47000 100000 100000 w g tx
i?0??0)g?u???b{ * * ?9 ?y?gw?g?yx?yw 1.5 ** ?9 ?y?gw?g?yx?yw 1.3 g please specify the capacitance tolerance code. * * test voltage of loading at high temperature test is 1.5 time of the rated voltage. ** test voltage of loading at high temperature test is 1.3 time of the rated voltage.
53 capacitors 4 ??aay part numbers w g tx
i?0??0)g?u???b{ g please specify the capacitance tolerance code. 1000 1500 2200 50v 3300 4700 b/x7r 2.5 w, r ? 10% 0.8 ? 0.10 6800 ? 20% (0.031 ? 0.004) 10000 25v 15000 22000 50v 10000 22000 f/y5v 5 w, r 80 ? 0.8 ? 0.10 25v 47000 20 ? (0.031 ? 0.004) 100000 y ?yy rated voltage f dc g yy? thickness h mm i (inch)
i?0? ? 0 ) capacitance tolerance [ l ] ?yy ?
i?0? capacitance h pf i 9s?
q temp.char yy ordering code umk10 7 b1 02 g z umk107 b152 g z umk107 b222 g z umk107 b332 g z umk107 b472 g z umk107 b682 g z umk107 b103 g z tmk107 b153 g z tmk107 b223 g z umk107 f103zz umk107 f223zz tmk107 f473zz tmk107 f104zz tan dissipation factor h % i max. ?
e soldering method r: ??? reflow soldering w: ?? wave soldering 107type(0603 case size)
76 v, w w a a z b d g d d d f g l d f h n m y 0.5 f 0.020 g 0.8 f 0.031 g 0.6 f 0.024 g 0.85 f 0.033 g 1.25 f 0.049 g 0.85 f 0.033 g 0.85 f 0.033 g 0.85 f 0.033 g 1.15 f 0.045 g 1.25 f 0.049 g 1.6 f 0.063 g 0.85 f 0.033 g 1.15 f 0.045 g 1.5 f 0.059 g 1.9 f 0.075 g 2.5 f 0.098 g 2.0max f 0.079 g g mk105 f 0402 g u vk105 f 0402 g g mk107 f 0603 g 0.8 f 0.031 g g 2k110 f 0504 g g mk212 f 0805 g g 4k212 f 0805 g g 2k212 f 0805 g g mk316 f 1206 g g mk325 f 1210 g a j
:? [ pcs ] f >n?a bulk packaging y 1000 mm f inch g code f a?e??ay taped packaging y a j
:? standard quantity [ pcs ]
a ?? thickness f eia g type p v, w w 0.3 f 0.012 g 0.5 f 0.020 g 0.5 f 0.020 g g mk063 f 0201 g g mk105 f 0402 g u vk105 f 0402 g mm f inch g code
a ?? thickness f eia g type e e 15000 10000 a j
:? standard quantity [ pcs ] a? paper ??a? embossed tape k a z b a k d g d d d f g l d f h n y m 0.45 f 0.018 g 0.8 f 0.031 g 0.8 f 0.031 g 0.6 f 0.024 g 0.45 f 0.018 g 0.85 f 0.033 g 1.25 f 0.049 g 0.85 f 0.033 g 0.85 f 0.033 g 0.85 f 0.033 g 1.15 f 0.045 g 1.25 f 0.049 g 1.6 f 0.063 g 0.85 f 0.033 g 1.15 f 0.045 g 1.5 f 0.059 g 1.9 f 0.075 g 2.0max f 0.079 g 2.5 f 0.098 g g mk107 f 0603 g g 2k110 f 0504 g g mk212 f 0805 g g 4k212 f 0805 g g 2k212 f 0805 g g mk316 f 1206 g g 4k316 f 1206 g g mk325 f 1210 g g mk432 f 1812 g e e e e e 3000 e e e 3000 2000 2000 2000 1000 500 500 4000 v e 4000 4000 4000 e 4000 4000 4000 e 4000 4000 4000 e e e e e e e 1.9 f 0.075 g 2.5 f 0.098 g 3.2 f 0.125 g y m u ay packaging 2 a?e??py taping material unit d mm f inch g 105, 107, 212 ypx0 ?`?bwpsemd<^m{ please contact any of our offices for accepting your requirement according to dimensions 0402, 0603, 0805.(inch) 3 ????y bulk cassette 1 7 ? !?o?
: minimum quantity
77 capacitors 4 ay packaging 3 a?e??
goy taping dimensions y ya?y paper tape 8mm ? f 0.315inches wide g yyyyyyyyyyyyyyyyyyyy unit d mm f inch g unit d mm f inch g type ??
? ?
?e?? a?? f eia g chip cavity insertion pitch tape thickness abfkt 3.7 m 0.2 4.9 m 0.2 8.0 m 0.1 0.6max. g mk432 f 1812 g f 0.146 m 0.008 gf 0.193 m 0.008 gf 0.315 m 0.004 g 4.0max. f 0.024max. g f 0.157max. g y??a?y embossed tape 8mm ? f 0.315inches wide g unit d mm f inch g 4 ??? ?? ?y leader and blank portion y 5 ???
goy reel size y 6 ??a?sy top tape strength y ??a?wxu`?x<
$1m2to 0.1 ? 0.7n qs??b{ the top tape requires a peel-off force of 0.1 v 0.7n in the direction of the arrow as illustrated below. ??a?y embossed tape 12mm ? f 0.472inches wide g type ??
? ?
?e?? a?? f eia g chip cavity insertion pitch tape thickness abfkt g mk212 f 0805 g 1.65 m 0.2 5 2.4 m 0.2 f 0.065 m 0.008 gf 0.094 m 0.008 g g mk316 f 1206 g 2.0 m 0.2 3.6 m 0.2 4.0 m 0.1 2.5max. 0.6max g 4k316 f 1206 g f 0.079 m 0.008 gf 0.142 m 0.008 gf 0.157 m 0.004 g f 0.098max. gf 0.024max. g g mk325 f 1210 g 2.8 m 0.2 3.6 m 0.2 3.4max. f 0.110 m 0.008 gf 0.142 m 0.008 g f 0.134max. g type ??
? ?
?e?? a?? f eia g chip cavity insertion pitch tape thickness abft g mk063 f 0201 g 0.37 m 0.06 5 0.67 m 0.06 55 2.0 m 0.05 0.45max. f 0.06 m 0.002 gf 0.027 m 0.002 gf 0.079 m 0.002 gf 0.018max. g g mk105 f 0402 g 0.65 m 0.1 5 1.15 m 0.1 55 2.0 m 0.05 0.8max. u vk105 f 0402 g f 0.026 m 0.004 gf 0.045 m 0.004 gf 0.079 m 0.002 gf 0.031max. g g mk107 f 0603 g 1.0 m 0.2 1.8 m 0.2 4.0 m 0.1 1.1max. f 0.039 m 0.008 gf 0.071 m 0.008 gf 0.157 m 0.004 gf 0.043max. g g 2k110 f 0504 g 1.15 m 0.2 1.55 m 0.2 4.0 m 0.1 1.0max. f 0.045 m 0.008 gf 0.061 m 0.008 gf 0.157 m 0.004 gf 0.039max. g g mk212 f 0805 g 1.65 m 0.2 5 2.4 m 0.2 g 4k212 f 0805 g f 0.065 m 0.008 gf 0.094 m 0.008 g 4.0 m 0.1 1.1max. g 2k212 f 0805 g f 0.157 m 0.004 gf 0.043max. g g mk316 f 1206 g 2.0 m 0.2 3.6 m 0.2 f 0.079 m 0.008 gf 0.142 m 0.008 g
79 capacitors 4 b: m 10%, m 20% f d % b: 2.5% max. (50v, 25v) f: 5.0% max. (50v, 25v) y b d m 10 l fk 25 v 85 cg f d l fk 25 v 85 cg b f x7r g d m 15 l f f y5v g d yy l reliability data 1/3 item temperature compensating (class 1) standard specified value test methods and remarks high permitivity (class 2) high value standard note1 k 55 to j 125 c k 55 to j 125 c 50vdc,25vdc, 16vdc no breakdown or dam- age 10000 m e min. 0.5 to 5 pf: m 0.25 pf 1 to 10pf: m 0.5 pf 5 to 10 pf: m 1 pf 11 pf or over: m 5% m 10% 105typer q , s q , t q , u q only 0.5 ? 2pf : m 0.1pf 2.2 ? 20pf : m 5 % under 30 pf : q u 400 + 20c 30 pf or over : q u 1000 c= nominal capacitance ck d 0 m 250 cj d 0 m 120 ch d 0 m 60 cg d 0 m 30 pk d k 150 m 250 pj d k 150 m 120 ph d k 150 m 60 rk d k 220 m 250 rj d k 220 m 120 rh d k 220 m 60 sk d k 330 m 250 sj d k 330 m 120 sh d k 330 m 60 tk d k 470 m 250 tj d k 470 m 120 th d k 470 m 60 uk d k 750 m 250 uj d k 750 m 120 sl d +350 to -1000 (ppm/ c ) appearance: no abnormality capacitance change: within m 5% or m 0.5 pf, whichever is larger. b d k 55 to j 125 c f d k 25 to j 85 c b d k 55 to j 125 c f d k 25 to j 85 c 50vdc,25vdc k 25 to j 85 c k 25 to j 85 c 50vdc,35vdc,25vdc 16vdc,10vdc,6.3vdc 4dvc 16vdc no abnormality no breakdown or damage 500 m ea f. or 10000 m e ., whichever is the smaller. note 5 0.5 to 2 pf : m 0.1 pf 2.2 to 5.1 pf : m 5% refer to detailed speci- fication ch d 0 m 60 rh d k 220 m 60 f ppm/ cg appearance: no abnormality capacitance change: within m 0.5 pf appearance: no abnormality capacitance change: b, bj, c: within m 12.5% e, f: within m 30% high frequency type 1.operating temperature range 2.storage temperature range 3.rated voltage 4.withstanding voltage between terminals 5.insulation resistance 6.capacitance (tolerance) 7. q or tangent of loss angle (tan d ) 8.temperature characteristic of capacitance 9.resistance to flexure of substrate (without voltage application) multilayer ceramic capacitor chips b d m 10 l z m 20 l c d m 10 l z m 20 l e d k 20 lnj 80 l f d k 20 lnj 80 l b d 2.5 l max. c z e z f d 7 l max. note 4 b d m 10 l y fk 25 vj 85 cg c d m 20 l y fk 25 vj 85 cg e d j 20 lnk 55 l y fk 25 vj 85 cg f d j 30 lnk 80 l y fk 25 vj 85 cg b f x7r z x5r g yy m 15 l c f x5s z x6s g yy m 22 l e f y5u g yy j 22 lnk 56 l f f y5v g yy j 22 lnk 82 l j 80 k 20 j 30 k 80 according to jis c 5102 clause 7.12. temperature compensating: measurement of capacitance at 20 c and 85 c shall be made to calculate temperature characteristic by the following equation. (c y - c y ) p 10 y (ppm/ c ) c y p q t y high permitivity: change of maximum capacitance deviation in step 1 to 5 temperature at step 1: +20 c temperature at step 2: minimum operating temperature temperature at step 3: +20 c (reference temperature) temperature at step 4: maximum operating temperature temperature at step 5: +20 c reference temperature for x7r, x5r, x5s, x6s, y5u and y5v shall be +25 c high capacitance type bj f x7r g d k 55 ? j 125 c ,bj f x5r g d k 55 ? j 85 c c f x5s g d k 55 ? j 85 c , c f x6s g d k 55 ? j 105 c e f y5u g d k 30 ? j 85 c , f f y5v g d k 30 ? j 85 c high capacitance type bj f x7r g d k 55 ? j 125 c ,bj f x5r g d k 55 ? j 85 c c f x5s g d k 55 ? j 85 c , c f x6s g d k 55 ? j 105 c e f y5u g d k 30 ? j 85 c , f f y5v g d k 30 ? j 85 c j 22 k 82 20 85 20 6 warp: 1mm testing board: glass epoxy-resin substrate thickness: 1.6mm (063 type : 0.8mm) the measurement shall be made with board in the bent position. applied voltage: rated voltage p 3 (class 1) rated voltage p 2.5 (class 2) duration: 1 to 5 sec. charge/discharge current: 50ma max. (class 1,2) applied voltage: rated voltage duration: 60 m 5 sec. charge/discharge current: 50ma max. measuring frequency d class1 d 1 " hz m 10% f c t 1000pf g 1 : hz m 10% f c x 1000pf g class2 d 1 : hz m 10% f c t 22 a f g 120hz m 10hz f c x 22 a f g measuring voltage d class1 d 0.5 v 5vrms f c t 1000pf g 1 m 0.2vrms f c x 1000pf g class2 d 1 m 0.2vrms f c t 22 a f g 0.5 m 0.1vrms f c x 22 a f g bias application: none multilayer: measuring frequency d class1 d 1 " hz m 10% f c t 1000pf g 1 : hz m 10% f c x 1000pf g class2 d 1 : hz m 10% f c t 22 a f g 120hz m 10hz f c x 22 a f g measuring voltage d yyyyyy class1 d 0.5 v 5vrms f c t 1000pf g 1 m 0.2vrms f c x 1000pf g class2 d 1 m 0.2vrms f c t 22 a f g 0.5 m 0.1vrms f c x 22 a f g bias application: none high-frequency-multilayer: measuring frequency: 1ghz measuring equipment: hp4291a measuring jig: hp16192a
81 capacitors 4 reliability data 2/3 10.body strength 11.adhesion of electrode 12.solderability 13.resistance to soldering 14.thermal shock 15.damp heat (steady state) no mechanical dam- age. appearance: no abnor- mality capacitance change: within m 2.5% q: initial value insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 0.25pf q: initial value insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 0.5pf, insulation resistance: 1000 m e min. appearance: no abnormality capacitance change: within m 7.5% (b, bj) within m 15% (c) within m 20% (e, f) tan d : initial value note 4 insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnormality capacitance change: within m 7.5% (b, bj) within m 15% (c) within m 20% (e , f) tan d : initial value note 4 insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 2.5% or m 0.25pf, whichever is larger. q: initial value insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 2.5% or m 0.25pf, whichever is larger. q: initial value insulation resistance: initial value withstanding voltage (between terminals): no abnormality appearance: no abnor- mality capacitance change: within m 5% or m 0.5pf, whichever is larger. q: c u 30 pf : q u 350 10 t c ? 30 pf: q u 275 + 2.5c c ? 10 pf : q u 200 + 10c c: nominal capacitance insulation resistance: 1000 m e min. no separation or indication of separation of electrode. at least 95% of terminal electrode is covered by new solder. appearance: no abnor- mality capacitance change: b: within m 12.5% f: within m 30% tan d : b: 5.0% max. f: 7.5% max. note 4 insulation resistance: 50 m ea f or 1000 m e whichever is smaller. note 5 appearance: no abnor- mality capacitance change: bj:within m 12.5% c(x6s) within m 25% c(x5s),e,f within m 30% tan d : note 4 bj: 5.0% max. c, e, f: 11.0% max. insulation resistance: 50 m ea f or 1000 m e whichever is smaller. note 5 high frequency multilayer: applied force: 5n duration: 10 sec. applied force: 5n duration: 30 m 5 sec. solder temperature: 230 m 5 c duration: 4 m 1 sec. preconditioning: thermal treatment (at 150 c for 1 hr) (applicable to class 2.) solder temperature: 270 m 5 c duration: 3 m 0.5 sec. preheating conditions: 80 to 100 c , 2 to 5 min. or 5 to 10 min. 150 to 200 c , 2 to 5 min. or 5 to 10 min. recovery: recovery for the following period under the stan- dard condition after the test. 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) preconditioning: thermal treatment (at 150 c for 1 hr) (applicable to class 2.) conditions for 1 cycle: step 1: minimum operating temperature c 30 m 3 min. step 2: room temperature 2 to 3 min. step 3: maximum operating temperature c 30 m 3 min. step 4: room temperature 2 to 3 min. number of cycles: 5 times recovery after the test: 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) item temperature compensating (class 1) standard test methods and remarks high permittivity (class 2) high value standard note1 high frequency type specified value multilayer d preconditioning: thermal treatment (at 150 c for 1 hr) (applicable to class 2.) temperature: 40 m 2 c humidity: 90 to 95% rh duration: 500 hrs recovery: recovery for the following period under the stan- dard condition after the removal from test chamber. 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) high-frequency multilayer: temperature: 60 m 2 c humidity: 90 to 95% rh duration: 500 hrs recovery: recovery for the following period under the stan- dard condition after the removal from test chamber. 24 m 2 hrs (class 1) multilayer ceramic capacitor chips +24 k 0 +24 k 0 j 0 k 3 k 0 j 3 0201 type 2n
83 capacitors 4 reliability data 3/3 according to jis c 5102 clause 9. 9. multilayer: preconditioning: voltage treatment (class 2) temperature: 40 m 2 c humidity: 90 to 95% rh duration: 500 hrs applied voltage: rated voltage charge and discharge current: 50ma max. (class 1,2) recovery: recovery for the following period under the standard condition after the removal from test chamber. 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) high-frequency multilayer: temperature: 60 m 2 c humidity: 90 to 95% rh duration: 500 hrs applied voltage: rated voltage charge and discharge current: 50ma max. recovery: 24 m 2 hrs of recovery under the standard condi- tion after the removal from test chamber. according to jis c 5102 clause 9.10. multilayer: preconditioning: voltage treatment (class 2) temperature:125 m 3 cf class 1, class 2: b, bj f x7r gg 85 m 2 c (class 2: bj,f) duration: 1000 hrs applied voltage: rated voltage p 2 note 6 recovery: recovery for the following period under the stan- dard condition after the removal from test chamber. as for ni product, thermal treatment shall be performed prior to the recovery. 24 m 2 hrs (class 1) 48 m 4 hrs (class 2) high-frequency multilayer: temperature: 125 m 3 c (class 1) duration: 1000 hrs applied voltage: rated voltage p 2 recovery: 24 m 2 hrs of recovery under the standard condi- tion after the removal from test chamber. 16.loading under damp heat 17.loading at high tempera- ture appearance: no abnor- mality capacitance change: c t 2 pf: within m 0.4 pf c x 2 pf: within m 0.75 pf c d nominal capaci- tance insulation resistance: 500 m e min. appearance: no abnor- mality capacitance change: within m 3% or m 0.3pf, whichever is larger. insulation resistance: 1000 m e min. appearance: no abnor- mality capacitance change: within m 7.5% or m 0.75pf, whichever is larger. q: c u 30 pf: q u 200 c ? 30 pf: q u 100 + 10c/3 c d nominal capaci- tance insulation resistance: 500 m e min. appearance: no abnor- mality capacitance change: within m 3% or m 0.3pf, whichever is larger. q: c u 30 pf : q u 350 10 t c ? 30 pf: q u 275 + 2.5c c ? 10 pf: q u 200 + 10c c d nominal capacitance insulation resistance: 1000 m e min. appearance: no abnor- mality capacitance change: bj d within m 12.5 l c z e z f d within m 30 l tan d d note 4 bj d 5.0 l max. c z e z f d 11 l max. insulation resistance: 25 m ea f or 500 m e , whichever is the smaller. note 5 appearance: no abnormality capacitance change: bj d within m 12.5 l within m 20 l ff within m 25 l ff c d within m 25 l (x6s) within m 30 l (x5s) e z f d within m 30 l tan d d note 4 bj d 5.0 l max. c z f z f d 11 l max. insulation resistance: 50 m ea f or 1000 m e , whichever is smaller. note 5 appearance: no abnor- mality capacitance change: b: within m 12.5% f: within m 30% tan d : b: 5.0% max. f: 7.5% max. note 4 insulation resistance: 25 m ea f or 500 m e , whichever is the smaller. note 5 appearance: no abnor- mality capacitance change: b: within m 12.5% f: within m 30% tan d : note 4 b: 4.0% max. f: 7.5% max. insulation resistance: 50 m ea f or 1000 m e , whichever is smaller. note 5 item temperature compensating (class 1) standard specified value test methods and remarks high permittivity (class 2) high value standard note1 high frequency type +24 k 0 +24 k 0 +48 k 0 +48 k 0 multilayer ceramic capacitor chips note 1 :for 105 type, specified in "high value". note 2 :thermal treatment (multilayer): 1 hr of thermal treatment at 150 j 0 / k 10 c followed by 48 m 4 hrs of recovery under the standard condition shall be performed before the measurement. note 3 : voltage treatment (multilayer): 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 4 8 m 4 hrs of recovery under the standard condition shall be performed before the measurement. note 4, 5 :the figure indicates typical inspection. please refer to individual specifications. note 6 :some of the parts are applicable in rated voltage p 1.5. please refer to individual specifications. note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 c of temperature, 45 to 85% relative humidity, and 86 to 106kpa of air pressure. when there are questions concerning measurement results: in order to provide correlation data, the test shall be conducted unde r condition of 20 m 2 c of temperature, 65 to 70% relative humidity, and 86 to 106kpa of air pressure. unless otherwise specified, all the tests are conducted under the "standard condition."
85 precautions capacitors 4 1/6 technical considerations stages precautions precautions on the use of multilayer ceramic capacitors 1.circuit design verification of operating environment, electrical rating and per- formance 1. a malfunction in medical equipment, spacecraft, nuclear re- actors, etc. may cause serious harm to human life or have severe social ramifications. as such, any capacitors to be used in such equipment may require higher safety and/or reli- ability considerations and should be clearly differentiated from components used in general purpose applications. operating voltage (verification of rated voltage) 1. the operating voltage for capacitors must always be lower than their rated values. if an ac voltage is loaded on a dc voltage, the sum of the two peak voltages should be lower than the rated value of the ca- pacitor chosen. for a circuit where both an ac and a pulse voltage may be present, the sum of their peak voltages should also be lower than the capacitor's rated voltage. 2. even if the applied voltage is lower than the rated value, the reliability of capacitors might be reduced if either a high fre- quency ac voltage or a pulse voltage having rapid rise time is present in the circuit. 1.the following diagrams and tables show some examples of recommended patterns to prevent excessive solder amourts. f larger fillets which extend above the component end terminations g examples of improper pattern designs are also shown. (1) recommended land dimensions for a typical chip capacitor land patterns for pcbs 2.pcb design pattern configurations (design of land-patterns) 1. when capacitors are mounted on a pcb, the amount of sol- der used (size of fillet) can directly affect capacitor performance. therefore, the following items must be carefully considered in the design of solder land patterns: (1) the amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to break- ing or cracking. therefore, when designing land-patterns it is necessary to consider the appropriate size and con- figuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. (2) when more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-re- sist. recommended land dimensions for wave-soldering (unit: mm) recommended land dimensions for reflow-soldering (unit: mm) type 107 212 316 325 1.6 2.0 3.2 3.2 0.8 5 1.25 1.6 2.5 a0.8 v 1.0 1.0 v 1.4 1.8 v 2.5 1.8 v 2.5 b0.5 v 0.8 0.8 v 1.5 0.8 v 1.7 0.8 v 1.7 c0.6 v 0.8 0.9 v 1.2 1.2 v 1.6 1.8 v 2.5 l w size excess solder can affect the ability of chips to withstand mechanical stresses. therefore, please take proper precautions when designing land-patterns. size l w type 063 105 107 212 316 325 432 0.6 1.0 1.6 2.0 3.2 3.2 4.5 0.3 0.5 0.8 5 1.25 1.6 2.5 3.2 a 0.20 v 0.30 0.45 v 0.55 0.6 v 0.8 0.8 v 1.2 1.8 v 2.5 1.8 v 2.5 2.5 v 3.5 b 0.20 v 0.30 0.40 v 0.50 0.6 v 0.8 0.8 v 1.2 1.0 v 1.5 1.0 v 1.5 1.5 v 1.8 c 0.25 v 0.40 0.45 v 0.55 0.6 v 0.8 0.9 v 1.6 1.2 v 2.0 1.8 v 3.2 2.3 v 3.5 size type 316 4 circuits 212 4 circuits 3.2 2.0 1.6 1.25 a0.7 v 0.9 0.5 v 0.6 b1 0.5 v 0.6 c0.4 v 0.5 0.2 v 0.3 d0.8 0.5 l w size type 212 2 circuits 110 2 circuits 2.0 1.37 1.25 1.0 a0.5 v 0.6 0.35 v 0.45 b0.5 v 0.6 0.55 v 0.65 c0.5 v 0.6 0.3 v 0.4 d 1.0 0.64 l w
87 precautions capacitors 4 2/6 (2) examples of good and bad solder application 2.pcb design 1-1. the following are examples of good and bad capacitor layout; smd capacitors should be located to minimize any possible mechanical stresses from board warp or deflection. not recommended recommended deflection of the board pattern configurations (capacitor layout on panelized [breakaway] pc boards) 1. after capacitors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufac- turing processes (pcb cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.) for this reason, planning pattern configurations and the position of smd capacitors should be carefully performed to minimize stress. items component placement close to the chassis not recommended recommended 1-2. to layout the capacitors for the breakaway pc board, it should be noted that the amount of mechanical stresses given will vary depending on capacitor layout. the example below shows recommendations for better design. 1-3. when breaking pc boards along their perforations, the amount of mechanical stress on the capacitors can vary according to the method used. the following methods are listed in order from least stressful to most stressful: push-back, slit, v-grooving, and perfora- tion. thus, any ideal smd capacitor layout must also consider the pcb splitting proce- dure. technical considerations stages precautions mixed mounting of smd and leaded components hand-soldering of leaded components near mounted components horizontal component placement precautions on the use of multilayer ceramic capacitors
89 precautions capacitors 4 3/6 3.considerations for auto- matic placement adjustment of mounting machine 1. excessive impact load should not be imposed on the capaci- tors when mounting onto the pc boards. 2. the maintenance and inspection of the mounters should be conducted periodically. technical considerations stages precautions 1. if the lower limit of the pick-up nozzle is low, too much force may be imposed on the capacitors, causing damage. to avoid this, the following points should be considered before lowering the pick-up nozzle: (1)the lower limit of the pick-up nozzle should be adjusted to the surface level of the pc board after correcting for deflection of the board. (2)the pick-up pressure should be adjusted between 1 and 3 n static loads. (3)to reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the pc board. the following dia- grams show some typical examples of good pick-up nozzle placement: not recommended recommended single-sided mounting double-sided mounting 2. as the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the capacitors because of mechanical impact on the capacitors. to avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. 1. some adhesives may cause reduced insulation resistance. the difference between the shrinkage percentage of the adhesive and that of the capacitors may result in stresses on the capacitors and lead to cracking. moreover, too little or too much adhesive applied to the board may adversely affect component placement, so the following precautions should be noted in the application of adhesives. (1)required adhesive characteristics a. the adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. the adhesive should have sufficient strength at high temperatures. c. the adhesive should have good coating and thickness consistency. d. the adhesive should be used during its prescribed shelf life. e. the adhesive should harden rapidly f. the adhesive must not be contaminated. g. the adhesive should have excellent insulation characteristics. h. the adhesive should not be toxic and have no emission of toxic gasses. (2)the recommended amount of adhesives is as follows; figure 212/316 case sizes as examples a 0.3mm min b 100 v 120 a m c adhesives should not contact the pad selection of adhesives 1. mounting capacitors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded capacitor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. there- fore, it is imperative to consult the manufacturer of the adhe- sives on proper usage and amounts of adhesive to use. precautions on the use of multilayer ceramic capacitors
91 precautions capacitors 4 4/6 4. soldering selection of flux 1. since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; (1)flux used should be with less than or equal to 0.1 wt% (equivelent to chroline) of halogenated content. flux hav- ing a strong acidity content should not be applied. (2)when soldering capacitors on the board, the amount of flux applied should be controlled at the optimum level. (3)when using water-soluble flux, special care should be taken to properly clean the boards. soldering temperature, time, amount of solder, etc. are specified in accor- dance with the following recommended conditions. and please contact us about peak temperature when you use lead-free paste. 1-1. when too much halogenated substance (chlorine, etc.) content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the capacitors. 1-2. flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. to mini- mize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of capacitors in high humidity conditions may cause a degrada- tion of insulation resistance and therefore affect the reliability of the components. the cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. 1-1. preheating when soldering heating: ceramic chip components should be preheated to within 100 to 130 c of the sol- dering. cooling: the temperature difference between the components and cleaning process should not be greater than 100 c . ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concen- trated heating or rapid cooling. therefore, the soldering process must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock. technical considerations stages precautions recommended conditions for soldering [reflow soldering] temperature profile caution 1. the ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the thick- ness of the capacitor, as shown below: 2. because excessive dwell times can detrimentally affect solderability, soldering dura- tion should be kept as close to recommended times as possible. [wave soldering] temperature profile caution 1. make sure the capacitors are preheated sufficiently. 2. the temperature difference between the capacitor and melted solder should not be greater than 100 to130 c 3. cooling after soldering should be as gradual as possible. 4. wave soldering must not be applied to the capacitors designated as for reflow solder- ing only. precautions on the use of multilayer ceramic capacitors
93 precautions capacitors 4 5/6 caution 1. use a 20w soldering iron with a maximum tip diameter of 1.0 mm. 2. the soldering iron should not directly touch the capacitor. [hand soldering] y temperature profile 5.cleaning cleaning conditions 1. when cleaning the pc board after the capacitors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of the cleaning (e.g. to remove soldering flux or other materials from the production process.) 2. cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the capacitor's characteristics. 1. the use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a degra- dation of the capacitor's electrical properties (especially insulation resistance). 2. inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimentally affect the performance of the capacitors. (1)excessive cleaning in the case of ultrasonic cleaning, too much power output can cause excessive vibration of the pc board which may lead to the cracking of the capacitor or the soldered portion, or decrease the terminal electrodes' strength. thus the following conditions should be carefully checked; ultrasonic output below 20 w/ b ultrasonic frequency below 40 khz ultrasonic washing period 5 min. or less 4. soldering 6.post cleaning processes 1. with some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the harden- ing period or while left under normal storage conditions result- ing in the deterioration of the capacitor's performance. 2. when a resin's hardening temperature is higher than the capacitor's operating temperature, the stresses generated by the excess heat may lead to capacitor damage or destruction. the use of such resins, molding materials etc. is not recom- mended. breakaway pc boards (splitting along perforations) 1. when splitting the pc board after mounting capacitors and other components, care is required so as not to give any stresses of deflection or twisting to the board. 2. board separation should not be done manually, but by using the appropriate devices. mechanical considerations 1. be careful not to subject the capacitors to excessive mechani- cal shocks. (1)if ceramic capacitors are dropped onto the floor or a hard surface, they should not be used. (2)when handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. 7.handling technical considerations stages precautions precautions on the use of multilayer ceramic capacitors
95 precautions capacitors 4 6/6 8.storage conditions storage 1. to maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. hu- midity should especially be kept as low as possible. y recommended conditions ambient temperature below 40 c humidity below 70% rh the ambient temperature must be kept below 30 c . even un- der ideal storage conditions capacitor electrode solderability decreases as time passes, so should be used within 6 months from the time of delivery. y ceramic chip capacitors should be kept where no chlorine or sulfur exists in the air. 2. the capacitance value of high dielectric constant capacitors (type 2 &3) will gradually decrease with the passage of time, so this should be taken into consideration in the circuit design. if such a capacitance reduction occurs, a heat treatment of 150 c for 1hour will return the capacitance to its initial level. 1. if the parts are stored in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. for this reason, components should be used within 6 months from the time of delivery. if exceeding the above period, please check solderability before using the capacitors. technical considerations stages precautions precautions on the use of multilayer ceramic capacitors

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